Unique R&D center of semiconductor devices in the industry

Top R&D talents introduced for technology innovation

Cooperation with a number of well-known enterprises such as Hisense

ROHS-compliant

Widespread application in many fields

Registered capital of CNY 30 million, 10000 m2 manufacturing workshop, package dimensions of SOT-23, SOD-123, SOD-323, monthly output up to 230KK

A new complete set of automatic production line, including ASM high-speed chip mounter, wire bonder and test host, DISCO dicing saw (up to 8″), Fushi......

All products are ROHS-compliant and manufactured with mature and advanced packaging technology, delivering stable quality and excellent consistency.