Quality System

Quality system

System Certifications Testing Equipments Reliability Equipments & Items FA Process & Capability

2012

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Pass ISO 9001-2008 certification

2015

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Pass renewal audit

2018

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Pass ISO 9001-2015 & ISO 14001 certification

2022

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Import IATF 16949

2026

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IATF 16949 is expected to be acquired in 2026

NJC-800 Industrial Inspection Microscope

NJC-800 Industrial Inspection Microscope

NK-GX-2010 Tool Microscope

NK-GX-2010 Tool Microscope

MFM1200 Push-Pull Force Testing Machine

MFM1200 Push-Pull Force Testing Machine

SDC-200S Contact Angle Meter

SDC-200S Contact Angle Meter

Tape Tensile Tester

Tape Tensile Tester

Projection measuring instrument

Projection measuring instrument

Programmable Constant Temperature and Humidity Test Chamber

Programmable Constant Temperature and Humidity Test Chamber

Two chambers for thermal shock testing

Two chambers for thermal shock testing

High-Temperature Reverse-Bias Test Chamber

High-Temperature Reverse-Bias Test Chamber

PCT test chamber

PCT test chamber

High-Temperature Storage Test Chamber

High-Temperature Storage Test Chamber

Reflow soldering machine

Reflow soldering machine

Test Item Equipment Model Manufacturer Test Condition Test Standard
Precondition B-TH-120A BOYI Bake: 125℃ 24hrs  JESD22-A113
MSL B-TH-120A BOYI TH:(Level1or level3) JSTD-020D.1
THT  B-TH-120A BOYI  85%/85℃ JESD22-A101
PCT  B-PCT-30-L BOYI  121℃ 100%RH JESD22-A102
HTST  B-RLLL-60 BOYI 150℃ JESD22-A103
TCT  B-TCT-603 BOYI  -65~150℃ dwell=15min JESD22-A104
HTRB  KTHA-415TBS KSON VR,T=85/110/125℃ JESD22-A108 
Reflow Soldering JTE-8800 Mingwei
FA Capability Cycle time
Non-destructive SAT 60min
X-RAY 10min
Optical inspection 5min
Parameter Verification ATE 5min
Bench Verification Pin to pin verification by curve tracer (Outsourcing) 24h
Decap Chemical decap 10min
Mechanical decap(x-section, ion milling Outsourcing) 24h
Laser decap (Outsourcing) 24h
Delayer Remove Au layer (chemical) 10min
Remove barrier layer(chemical) 10min
Remove backside Au layer(chemical) 10min
Fault Isolation Liquid crystal analysis (Outsourcing) 24h
EMMI (InGaAS, Outsourcing) 24h
OBIRCH (Outsourcing) 24h
Fault Characterization SEM /EDX (Outsourcing) 24h
FIB (Outsourcing) 72h
X-RAY

X-RAY

Ultrasound scanner

Ultrasound scanner